On May 5, TSMC Arizona held a topping-out ceremony for PH3, the third wafer fab in its Fab21 semiconductor cluster. Construction began in April 2025, and the main structure is now complete.

PH3 is designed for advanced 2nm-class process technologies (N2/A16) , with mass production targeted for the late 2020s, helping close the US advanced chip manufacturing gap.

The first fab in the cluster is already in high-volume production. The second fab is on track for equipment move-in later this year and is expected to start production in the second half of 2027.

Phoenix Mayor Kate Gallego attended the ceremony. TSMC thanked thousands of workers, suppliers, and local communities for their support.

ICgoodFind: TSMC’s third Arizona fab topping out marks steady progress in US 2nm expansion, strengthening global foundry supply chains.